? semiconductor components industries, llc, 2013 november, 2013 ? rev. 12 1 publication order number: mbrb2545ct/d mbrb2545ctg, SBRB2545CTG switchmode power rectifier d 2 pak surface mount power package the d 2 pak power rectifier is a state ? of ? the ? art device that employs the schottky barrier principle with a platinum barrier metal. features ? center ? tap configuration ? guardring for stress protection ? low forward voltage ? 175 c operating junction temperature ? epoxy meets ul 94 v ? 0 @ 0.125 in ? short heat sink tab manufactured ? not sheared ? similar in size to the industry standard to ? 220 package ? aec ? q101 qualified and ppap capable ? sbrb prefix for automotive and other applications requiring unique site and control change requirements ? all packages are pb ? free* mechanical characteristics ? case: epoxy, molded, epoxy meets ul 94 v ? 0 ? weight: 1.7 grams (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl1 requirements ? esd ratings: ? machine model = c (> 400 v) ? human body model = 3b (> 8000 v) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. schottky barrier rectifier 30 amperes, 45 volts 1 3 4 http://onsemi.com see detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ordering information d 2 pak case 418b style 3 marking diagram b2545g aka a = assembly location y = year ww = work week b2545 = device code g = pb ? free package aka = diode polarity ay ww
mbrb2545ctg, SBRB2545CTG http://onsemi.com 2 maximum ratings (per leg) rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 45 v average rectified forward current (rated v r , t c = 164 c) total device i f(av) 15 30 a peak repetitive forward current (rated v r , square wave, 20 khz, t c = 160 c) i frm 30 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 150 a peak repetitive reverse surge current (2.0 s, 1.0 khz) i rrm 1.0 a storage temperature range t stg ? 65 to +175 c operating junction temperature (note 1) t j ? 65 to +175 c voltage rate of change (rated v r ) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. the heat generated must be less than the thermal conductivity from junction ? to ? ambient: dp d /dt j < 1/r ja . thermal characteristics (per leg) characteristic symbol value unit thermal resistance, junction ? to ? case junction ? to ? ambient (note 2) r jc r ja 1.5 50 c/w 2. when mounted using minimum recommended pad size on fr ? 4 board. electrical characteristics (per diode) symbol characteristic condition min typ max unit v f instantaneous forward voltage (note 3) i f = 15 amp, t j = 25 c i f = 15 amp, t j = 125 c i f = 30 amp, t j = 25 c i f = 30 amp, t j = 125 c ? ? ? ? ? 0.50 ? 0.65 0.62 0.57 0.82 0.72 v i r instantaneous reverse current (note 3) v r = 45 volts, t j = 25 c v r = 45 volts, t j = 125 c ? ? ? 9.0 0.2 25 ma 3. pulse test: pulse width = 300 s, duty cycle 2.0%. ordering information device package shipping ? mbrb2545ctg d 2 pak (pb ? free) 50 units / rail SBRB2545CTG d 2 pak (pb ? free) 50 units / rail mbrb2545ctt4g d 2 pak (pb ? free) 800 units / tape & reel sbrb2545ctt4g d 2 pak (pb ? free) 800 units / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
mbrb2545ctg, SBRB2545CTG http://onsemi.com 3 t c , case temperature ( c) , average forward power dissipation (watts) dc = 20 i pk i av square wave 32 28 24 20 16 12 8 4 0 p f(av) 32 28 24 20 16 12 8 4 i f , average forward current (amps) 03640 5 t j = 125 c (resistive load) = i pk i av (capacitive loads) 10 figure 1. typical forward voltage, per leg figure 2. typical reverse current, per leg figure 3. typical forward power dissipation figure 4. current derating, case per leg 0.6 0 v f , instantaneous forward voltage (volts) 1000 10 v r , reverse voltage (volts) 0 0.2 0.04 0.02 0.002 i f , instantaneous forward current (amps) i 1.0 0.2 0.4 0.8 10 20 30 40 0.1 0.4 1.0 0.1 1.0 50 , reverse current (ma) r 4.0 2.0 10 20 100 40 200 t j = 125 c 150 c 25 c t j = 150 c 125 c 100 c 100 0.01 0.004 25 c 75 c 1.6 1.2 1.4 1.8 26 24 22 20 18 16 14 12 10 8 6 4 2 0 145 150 155 160 165 170 175 i f(av) , average forward current (a) square dc
mbrb2545ctg, SBRB2545CTG http://onsemi.com 4 package dimensions seating plane s g d ? t ? m 0.13 (0.005) t 23 1 4 3 pl k j h v e c a dim min max min max millimeters inches a 0.340 0.380 8.64 9.65 b 0.380 0.405 9.65 10.29 c 0.160 0.190 4.06 4.83 d 0.020 0.035 0.51 0.89 e 0.045 0.055 1.14 1.40 g 0.100 bsc 2.54 bsc h 0.080 0.110 2.03 2.79 j 0.018 0.025 0.46 0.64 k 0.090 0.110 2.29 2.79 s 0.575 0.625 14.60 15.88 v 0.045 0.055 1.14 1.40 ? b ? m b w w notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 418b ? 01 thru 418b ? 03 obsolete, new standard 418b ? 04. f 0.310 0.350 7.87 8.89 l 0.052 0.072 1.32 1.83 m 0.280 0.320 7.11 8.13 n 0.197 ref 5.00 ref p 0.079 ref 2.00 ref r 0.039 ref 0.99 ref m l f m l f m l f variable configuration zone r n p u view w ? w view w ? w view w ? w 123 d 2 pak 3 case 418b ? 04 issue k style 3: pin 1. anode 2. cathode 3. anode 4. cathode *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 8.38 5.080 dimensions: millimeters pitch 2x 16.155 1.016 2x 10.49 3.504
mbrb2545ctg, SBRB2545CTG http://onsemi.com 5 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbrb2545ct/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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